Epibond 215 A/B Epoxy Adhesive 200 ml Cartridge
Epibond 215 A/B Adhesive is an extrudable, two component, room temperature-curing epoxy structural adhesive designed for service temperatures up to 300°F (149°C).
Technical Information
- UN Number UN2735 CL8
- Product Type Epoxy Adhesive
- Product Form Liquid
Product Information
This adhesive is suitable for bonding a wide variety of materials such as metals, composites and many other dissimilar substrates. The combination of high peel strength and high shear makes this adhesive well-suited for aerospace and other demanding applications.
Features:
- Room Temperature cure
- Fast Handling Strength
- Outstanding Peel and High Shear Strength
- Service Temperature from -90°F (-68°C) to 300°F (149°C)
- Good retention of strength after environmental ageing or chemical immersion
- Gap-filling thixotropic paste
- 2:1 mix ratio by weight and volume
- Low Outgassing
Data Sheets
Product Properties
Additional Content
Shipping Information
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