3M Scotch-Weld AF 555 Structural Adhesive Film
3M Scotch-Weld Structural Adhesive Film AF 555 is a thermosetting, modified epoxy adhesive film. It was designed for bonding of composites in conjunction with honeycomb or in a monolithic structure. This product can be co-cured, co-bonded with composite prepregs, or used to bond cured composite.
Technical Information
- Product Type Structural Adhesive
- Product Form Film
Product Information
Features:
- Excellent pre-bond humidity performance on composite substrates
- Unsupported version available for reticulation
- Film adhesive can be cured from 300°F (150°C) up to 355°F (180°C)
- One year out time at ambient conditions
- Excellent shop handling characteristics
Data Sheets
Product Properties
Additional Content
Shipping Information
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