Bergquist Gap Filler TGF 4500CVO
Bergquist TGF 4500CVO is a two-part, high performance, thermally conductive, liquid gap filling material.
- Product Type Filler
The mixed material will cure at room temperature but can be accelerated with the addition of heat.
TGF 4500CVO has controlled volatile outgassing silicones for sensitive applications and a high dispensing rate in customer application. This liquid-dispensed material offers infinite thickness variation and imparts little and reduced stress on components during assembly. As cured, TGF 4500CVO offers a soft, thermally conductive, form-in-place elastomer to fill voids and gaps in the customer assembly.
- Power inverter
- Surface mount power switching
- EV charger
- Use between heat generating semiconductor packages and heatsink
For information about the available delivery options please visit our Shipping Guide.
Some products in our catalog are classified as Hazardous for shipping so some restrictions and/or additional shipping fees may apply.