High-Performance Potting Compounds & Encapsulants

Protect Your Critical Components Against the Elements

GracoRoberts provides a comprehensive range of premium potting compounds (also known as encapsulants) engineered to protect sensitive electronic components, modules, and assemblies from the most demanding operational environments. Our specialized formulas create a robust, cured barrier, guaranteeing protection against:

• Environmental Stress: Moisture, humidity, corrosion, and chemical exposure.
• Physical Stress: Vibration, shock, and mechanical stress (e.g. during deep-sea or aerospace applications).
• Thermal Stress: Extreme temperatures, rapid thermal cycling, and efficient heat dissipation.
• Security Threats: Tampering and securing sensitive intellectual property (IP).

Potting Compound Selection: Chemistry and Performance Guidance

Choosing the right compound is a critical engineering decision based on the required final properties:

Epoxy Potting Compounds

Known for their high mechanical strength, excellent adhesion, and superior chemical resistance. Epoxies create a durable, rigid barrier ideal for structural bonding and coil winding in high-vibration applications.

Urethane Potting Compounds

Offer high flexibility and excellent elongation, making them perfect for vibration dampening in automotive sensors and cable assemblies. They provide a balance of performance and cost-effectiveness.

Silicone Potting Compounds

Feature the widest service temperature range, highest flexibility, and superior moisture protection. Silicones place minimal stress on delicate components, making them essential for high-heat EV modules and sensitive aerospace electronics.

Applications Where Performance Matters Most

• Aerospace & Defense: Compounds meeting stringent MIL-SPECS for flight systems and navigational equipment.
• Electric Vehicles (EV) & Automotive: Formulations prioritizing thermal management and vibration resistance for battery modules and power electronics.
• Power & Energy: Encapsulants for transformers and control boxes requiring high dielectric strength and heat dissipation.
  

The GracoRoberts Advantage: Solutions Beyond the Can

We partner with you to solve your specific engineering challenges. Our services include: Custom Formulation & Packaging for exact specifications, Quality Assurance & Traceability critical for Aerospace, and expert Technical Support on dispensing and application techniques.

Potting Compound FAQs

What is the difference between potting and encapsulation?

The terms are often used interchangeably, but generally: Potting involves filling the entire enclosure or housing containing the component with the material, which then becomes a permanent part of the device (the housing is not removed). Encapsulation (or glob topping) typically involves coating the component in a thinner layer or sphere of material, which is then cured. Both processes achieve environmental protection.

Which potting compound is best for high heat and temperature cycling?

Silicone-based compounds offer the best performance in extreme and cycling temperature environments. They maintain elasticity and mechanical properties across the widest temperature range (typically −50∘C to over 200∘C), minimizing stress on delicate components during thermal expansion and contraction.

How do I choose between epoxy, silicone, and urethane potting compounds?

Your choice depends on the primary stress factor: 1. Epoxy for maximum mechanical strength and chemical resistance. 2. Silicone for superior flexibility and protection against extreme or rapidly cycling temperatures. 3. Urethane for excellent vibration dampening and a balance of performance and cost-effectiveness.

Can potting compounds protect sensitive Intellectual Property (IP)?

Yes. Certain rigid epoxy and urethane compounds, especially those tinted opaque black, are designed to be extremely difficult to remove without destroying the underlying components. This effectively secures sensitive circuitry and proprietary designs against reverse engineering and tampering.

What does "thermally conductive" mean in a potting compound?

A thermally conductive potting compound is formulated with fillers that allow it to efficiently transfer heat away from the sensitive electronic components it covers to the outer housing or a heat sink. This is critical for preventing overheating and extending the lifespan of high-power electronics.