Loctite Stycast 1090 Black Epoxy Encapsulant

Low shrinkage during cure and low thermal expansion coefficient are other important properties and it cures at room or elevated temperatures to a black, rigid solid. The elevated temperature cure produces superior properties, including a low dielectric constant and, therefore, minimum effect on circuit operation.

When cured, the material is completely unicellular and moisture absorption is negligible. The density of Stycast 1090 is much less than half of that of other commonly used encapsulants.

Applications:

Stycast 1090 is particularly useful in airborne embedment applications and it may be used over the temperature range of -75°C to +175°C without harmful results. Because of the low thermal expansion coefficient large metallic inserts can be embedded with no cracking of the encapsulant on temperature cycling.