EPO-TEK® H20E A/B PMF Electrical Adhesive 1 ml Syringe
EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system designed for chip bonding in microelectronic and optoelectronic applications.
Technical Information
- UN Number UN3082 CL9
- Product Type Specialty Adhesive
- Product Form Liquid
Product Information
It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications.
Data Sheets
Product Properties
Shipping Information
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