CHO-BOND 360-20 Electrically Conductive Epoxy Adhesive 85 g (1/2 pt) Can Kit
GracoRoberts P/N: 120514-101
$304.15
CHO-BOND 360-20 is a silver-plated copper filled, two-component conductive epoxy adhesive designed for applications where a strong, conductive electrical bond must be achieved. It is good for filling rather large bond lines and cracks (0.004 inches-0.025 inches) of electrical boxes and enclosures.
Technical Information
- Product Type Epoxy Adhesive
- Product Form Paste
Product Information
Features:
- Fast heat cure, increases throughput, minimizes equipment downtime
- Silver-plated copper filler
- Low cost, good conductivity 0.005 ohm-cm
- No VOCs
- Minimal shrinkage, no permits or ventilation required
Data Sheets
Product Properties
Brand
Parker Hannifin CHO-BOND
Manufacturer
Parker Hannifin Corp.
Product Type
Epoxy Adhesive
Product Form
Paste
Product Size
85 g (1/2 pt) Can Kit
Manufacturer Part #
50-00-0360-0020
Country Of Origin
United States
Shipping Information
For information about the available delivery options please visit our Shipping Guide.
Some products in our catalog are classified as Hazardous for shipping so some restrictions and/or additional shipping fees may apply.