CHO-BOND 360-20 Electrically Conductive Epoxy Adhesive
From $304.15
CHO-BOND 360-20 is a silver-plated copper filled, two-component conductive epoxy adhesive designed for applications where a strong, conductive electrical bond must be achieved. It is good for filling rather large bond lines and cracks (0.004 inches-0.025 inches) of electrical boxes and enclosures.
Technical Information
- Product Type Epoxy Adhesive
- Product Form Paste
Product Information
Features:
- Fast heat cure, increases throughput, minimizes equipment downtime
- Silver-plated copper filler
- Low cost, good conductivity 0.005 ohm-cm
- No VOCs
- Minimal shrinkage, no permits or ventilation required
Data Sheets
Product Properties
Brand
Parker Hannifin CHO-BOND
Manufacturer
Parker Hannifin Corp.
Product Type
Epoxy Adhesive
Product Form
Paste
Manufacturer Part #
50-00-0360-0020 | 50-01-0360-0020
Shipping Information
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