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CHO-BOND 584-208 is a silver filled, two-component conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.

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CHO-BOND 584-208 Electrically Conductive Epoxy Adhesive 85 g (4 fl oz) Can Kit

GracoRoberts P/N: 154493-100

CHO-BOND 584-208 is a silver filled, two-component conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.

Technical Information

  • Product Type Epoxy Adhesive
  • Product Form Paste

Product Information

Features:

  • Fast heat cure, increases throuhgput, minimizes equipment downtime
  • Silver filler
  • Good conductivity 0.002 ohm-cm
  • No VOCs
  • Minimal shrinkage, no permits or ventilation required

Data Sheets

No Datasheets Available

Product Properties

Brand
Parker Hannifin CHO-BOND
Manufacturer
Parker Hannifin Corp.
Product Type
Epoxy Adhesive
Product Form
Paste
Product Size
85 g (4 fl oz) Can Kit
Manufacturer Part #
50-00-0584-0208
Country Of Origin
United States

Shipping Information

For information about the available delivery options please visit our Shipping Guide.

Some products in our catalog are classified as Hazardous for shipping so some restrictions and/or additional shipping fees may apply.