CHO-BOND 584-208 Electrically Conductive Epoxy Adhesive 85 g (4 fl oz) Can Kit
CHO-BOND 584-208 is a silver filled, two-component conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.
Technical Information
- Product Type Epoxy Adhesive
- Product Form Paste
Product Information
Features:
- Fast heat cure, increases throuhgput, minimizes equipment downtime
- Silver filler
- Good conductivity 0.002 ohm-cm
- No VOCs
- Minimal shrinkage, no permits or ventilation required
Data Sheets
Product Properties
Shipping Information
For information about the available delivery options please visit our Shipping Guide.
Some products in our catalog are classified as Hazardous for shipping so some restrictions and/or additional shipping fees may apply.