CHO-BOND 584-29 Epoxy Adhesive
From $216.51
CHO-BOND 584-29 is a silver filled, two-component conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved. It is recommended for relatively small bond lines (less than 0.010 inches (0.25mm)) but can be used for larger bond lines in applications where vibration or potential for cracking is not an issue.
Technical Information
- Product Type Epoxy Adhesive
- Product Form Paste
Product Information
Features:
- Fast heat cure, increases throughput, minimizes equipment downtime
- Silver filler
- Excellent conductivity 0.002 ohm-cm
- Low VOCs
- Minimal shrinkage
Data Sheets
Product Properties
Brand
Parker Hannifin CHO-BOND
Manufacturer
Parker Hannifin Corp.
Product Type
Epoxy Adhesive
Product Form
Paste
Manufacturer Part #
50-00-0584-0029 | 50-02-0584-0029 | 50-03-0584-0029
Shipping Information
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