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CHO-BOND 1138 is a silver-plated copper filled, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. It may be used for EMI gasket repair, bonding and attachment in applications where moderate strength (less than 150 psi) is required.

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CHO-BOND 1038 Electrically Conductive Silicone Sealant (Includes 1086 Primer)

From $1,164.89
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CHO-BOND 1138 is a silver-plated copper filled, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. It may be used for EMI gasket repair, bonding and attachment in applications where moderate strength (less than 150 psi) is required.

Technical Information

  • Product Type Specialty Sealant
  • Product Form Paste

Product Information

Features:

  • Easy to use, no weighing or mixing required
  • Silver plated copper filler
  • Excellent conductivity 0.010 ohm-cm
  • Non corrosive cure mechanism
  • Minimal shrinkage, no permits or ventilation required

Data Sheets

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Product Properties

Brand
Parker Hannifin CHO-BOND
Manufacturer
Parker Hannifin Corp.
Product Type
Specialty Sealant
Product Form
Paste
Manufacturer Part #
50-01-1038-0000 | 50-02-1038-0000

Shipping Information

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