CHO-BOND 1121 Electrically Conductive Silicone Sealant 454 g (6 fl oz) Semco Cartridge (Includes 1086 Primer)
CHO-BOND 1121 is a silver-plated copper filled, one-component conductive silicone. It is the solvent free version of CHO-BOND 1038. For best adhesion results, it should be used in conjuction with CHO-BOND 1086 primer (included). It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. It may be used for EMI gasket repair, bonding and attachment in applications where moderate strength (less than 150 psi) is required.
Technical Information
- UN Number UN1866 CL3
- Product Type Specialty Silicone
- Product Form Paste
Product Information
Features:
- Easy to use, no weighing or mixing required
- Silver plated copper filler
- No VOCs
- Excellent conductivity 0.010 ohm-cm
- Non corrosive cure mechanism
- Minimal shrinkage, no permits or ventilation required
Data Sheets
Product Properties
Shipping Information
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