SilCool TIA241GF Gap Filler
Momentive SilCool TIA241GF is a two component soft, thermally conductive silicone material used to dissipate heat from electronic devices.
Technical Information
- Product Type Filler
- Product Form Liquid
Product Information
Features:
- Good thermal conductivity
- Fast, low temperature cure
- Convenient 1:1 mix ratio by weight
- Retained softness after cure for enhanced stress relieve during thermal cycling
- Excellent slump resistance (stays in place)
- Repairable
Data Sheets
Product Properties
Additional Content
Shipping Information
For information about the available delivery options please visit our Shipping Guide.
Some products in our catalog are classified as Hazardous for shipping so some restrictions and/or additional shipping fees may apply.