3M Scotch-Weld AF 501U Structural Adhesive Film
3M Scotch-Weld Structural Adhesive Film AF 501 is a next-generation 250°F (121°C) curing thermosetting epoxy adhesive film. Engineered for the bonding of metal, composite, and honeycomb structures, it integrates smoothly into established aerospace manufacturing processes with broad compatibility across surface treatments, water or solvent based primers, and standard cure cycle requirements. This product, AF 501U, is supplied as a Unsupported Film.
Technical Information
- Product Type Structural Adhesive
- Product Form Film
Product Information
Features:
- Exceptional mechanical performance and high peel strength comparable to 3M Scotch-Weld Structural Adhesive Film AF 163-2
- 250°F (121°C) curing epoxy adhesive film formulated to provide durability in metal and composite bonding of aerospace structures
- Compatible with a range of water-based and solvent-based primers
- Minimum of 50 days out time at 23°C / 75°F without loss in OLS and FRP performance
Data Sheets
Product Properties
Additional Content
Shipping Information
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