Quick View
Product Code: 
$
Skip to main content

NASA Low-Outgassing Epoxy Solutions

When performance in vacuum environments matters most, trust Resin Formulators' line of low-outgassing epoxy systems—specially formulated and tested to meet NASA's ASTM E595 standard for outgassing performance.

In aerospace, satellites, and high-vacuum applications, material outgassing can compromise optics, sensors, and overall system performance. That’s why NASA developed ASTM E595, a rigorous standard to identify materials with low Total Mass Loss (TML) and Collected Volatile Condensable Material (CVCM). Our epoxies pass with flying colors. Click here to learn more about our low-outgassing epoxy systems.

Our Low-Outgassing Epoxies Are:

 Tested and Compliant – Independently tested to meet ASTM E595
 Precision Formulated – Minimal TML and CVCM for sensitive environments
 Versatile – Available in a range of viscosities, cure speeds, and packaging options
 Reliable – Trusted for aerospace, optics, electronics, and vacuum system applications

Technical Expertise and Support

Whether you're engineering for orbit or high-precision instrumentation, our team of chemists and formulation experts are here to support your needs. Click here for a free consultation.

Speed, Strength, and Precision: Advancing Aerospace Production with RF 1163 Epoxy Syntactic Resin

 
A major aerospace manufacturer faced a challenge in finding a fast, reliable material for sealing edges and honeycomb cores in large composite structures. They required a solution that offered high strength and low density, was non-slump and easily dispensable for point-of-use, cured quickly to maintain production speed, and met the rigorous demands of high-temperature aerospace environments.

Resin Formulators answered with RF 1163 A/B, a high-temperature epoxy syntactic resin packaged in ready-to-use cartridges. This innovative format improved processing efficiency by allowing technicians to mix and dispense the material directly where needed—saving time, minimizing waste, and reducing the potential for foreign object debris (FOD) and cleanup. With an aggressive ramp rate and a one-hour post cure, RF 1163 set up rapidly at room temperature, enabling laminate placement without delay and accelerating overall production throughput.

The results were clear: manufacturing efficiency improved thanks to faster ambient ramp rates, parts maintained strong yet lightweight performance with a compressive strength of 9,300 psi at just 0.66 g/cc, and the cartridge system created a cleaner, safer work environment. In addition, RF 1163 meets NASA outgassing requirements, making it ideal for demanding aerospace and space applications—including rocket structures, fuselages, fairings, crew capsules, and launch vehicles.

RF 1163 delivered the speed, strength, and reliability needed to keep critical aerospace production moving on schedule.