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NASA Low-Outgassing Epoxy Solutions

When performance in vacuum environments matters most, trust Resin Formulators' line of low-outgassing epoxy systems. These materials are specially formulated and tested to meet NASA's ASTM E595 standard for outgassing performance. In aerospace, satellites, and high-vacuum applications, material outgassing can compromise optics, sensors, and overall system performance. NASA developed ASTM E595 to evaluate low Total Mass Loss (TML) and Collected Volatile Condensable Material (CVCM), and the full capabilities summary is available here: Click here to learn more.
Our Low-Outgassing Epoxies Are:

  • Tested and Compliant – Independently tested to meet ASTM E595
  • Precision Formulated – Minimal TML and CVCM for sensitive environments
  • Versatile – Available in a range of viscosities, cure speeds, and packaging options
  • Reliable – Trusted for aerospace, optics, electronics, and vacuum system applications

Technical Expertise and Support

Whether you're engineering for orbit or high-precision instrumentation, our team of chemists and formulation experts are here to support your needs. Click here for a free consultation.

NASA ASTM E595 Low-Outgassing Epoxy Solutions

ASTM E595 Standards and Outgassing Criteria

ASTM E595 is the standard used to evaluate low-outgassing materials for sensitive aerospace and vacuum environments. The most useful pass criteria are Total Mass Loss (TML) and Collected Volatile Condensable Material (CVCM), which help engineers assess contamination risk for spacecraft, satellites, optics, and other high-reliability assemblies. Resin Formulators' low-outgassing epoxy systems are positioned for these applications.

Potting Materials

Choose the low-outgassing epoxy system that best fits your build by comparing viscosity, cure speed, packaging format, and end-use environment. The product groups below help buyers evaluate options for potting, structural pastes, syntactic materials, and electrically conductive applications.

Structural Pastes

Syntactics

Electrically Conductive Adhesives

Speed, Strength, and Precision: Advancing Aerospace Production with RF 1163 Epoxy Syntactic Resin

A major aerospace manufacturer faced a challenge in finding a fast, reliable material for sealing edges and honeycomb cores in large composite structures. They required a solution that offered high strength and low density, was non-slump and easily dispensable for point-of-use, cured quickly to maintain production speed, and met the rigorous demands of high-temperature aerospace environments.

Resin Formulators answered with RF 1163 A/B, a high-temperature epoxy syntactic resin packaged in ready-to-use cartridges. This innovative format improved processing efficiency by allowing technicians to mix and dispense the material directly where needed—saving time, minimizing waste, and reducing the potential for foreign object debris (FOD) and cleanup. With an aggressive ramp rate and a one-hour post cure, RF 1163 set up rapidly at room temperature, enabling laminate placement without delay and accelerating overall production throughput.

The results were clear: manufacturing efficiency improved thanks to faster ambient ramp rates, parts maintained strong yet lightweight performance with a compressive strength of 9,300 psi at just 0.66 g/cc, and the cartridge system created a cleaner, safer work environment. In addition, RF 1163 meets NASA outgassing requirements, making it ideal for demanding aerospace and space applications—including rocket structures, fuselages, fairings, crew capsules, and launch vehicles.

RF 1163 delivered the speed, strength, and reliability needed to keep critical aerospace production moving on schedule.

Frequently Asked Questions About Low-Outgassing Epoxy Systems

What applications are these low-outgassing epoxy systems used for?

These low-outgassing epoxy systems are intended for aerospace, satellite, vacuum, optics, sensors, and high-reliability electronics applications where contamination control matters.

Which product family should I review first?

Start with the product family that best matches the use case. Potting Materials support encapsulation and fill applications, Structural Pastes support bonding and repair, Syntactics support lightweight structural applications, and Electrically Conductive Adhesives support electrical assembly needs.

When should I request a consultation?

Request a consultation when the application needs validation, the material fit is unclear, or the project calls for help matching the right Resin Formulators product to the use case.