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Electronics manufacturing demands materials that balance precision, protection, and performance. GracoRoberts offers adhesives, conformal coatings, potting compounds, and thermal interface materials engineered for printed circuit board assembly, device sealing, and environmental protection. Our portfolio includes ESD-safe adhesives for sensitive components and high-thermal-conductivity products for effective heat management.
We serve electronics manufacturers across aerospace, defense, automotive, and industrial controls, providing products that protect against moisture, dust, vibration, and temperature extremes. Whether you need a low-outgassing adhesive for optical components, a silicone potting compound for harsh environments, or a UV-cure coating for fast throughput, our experts will match you with the right solution. Explore our electronics manufacturing materials and thermal management solutions to extend the life and reliability of your devices.
Selecting the right material is critical in electronics manufacturing. When evaluating potting compounds and thermal conductive adhesives, consider factors such as:
Our team can help you review these criteria and recommend potting compounds and thermal conductive materials that align with your design, production, and reliability goals.
In electronics manufacturing, potting is the process of filling an electronic assembly or housing with a protective compound, often an epoxy, polyurethane, or silicone. By encapsulating components, potting helps shield sensitive circuits from moisture, dust, corrosion, vibration, and thermal shock, while also improving electrical insulation. In security conscious applications, potting compounds can also make it more difficult to tamper with or reverse engineer a design, adding another layer of protection for high value electronics.
Many high-reliability electronics manufacturing programs require potting compounds and thermal conductive adhesives that go beyond basic protection. Through our supplier partners, GracoRoberts offers materials with advanced properties, including options with flame-retardant performance, excellent moisture resistance, and low-exotherm formulations suitable for deep-section pours. For densely packed assemblies and temperature-sensitive designs, we can also support thermally conductive solutions that help move heat away from critical components while maintaining electrical insulation.
